Lista de procesadores móviles Intel Core

A continuación se muestra una lista de procesadores móviles Intel Core . Esto incluye la serie móvil original Intel Core (Solo/Duo) basada en la microarquitectura Enhanced Pentium M ; así como sus procesadores de marca Core 2– (Solo/Duo/Quad/Extreme), Core i3–, Core i5–, Core i7–, Core i9–, Core M– (m3/m5/m7), Core 3–, Core 5–, Core 7– y Core 9–.

Centro

Yonah

Núcleo 2

Interior de un antiguo portátil Sony VAIO (VGN-C140G)

"Merom-L" (65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT).
^Tamañode la matriz : 81 mm²
Pasos : A1

"Merom", "Merom-2M" (voltaje estándar, 65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2)
El modelo T7600G cuenta con un multiplicador de reloj desbloqueado. Solo se vende como equipo original (OEM) en el Dell XPS M1710.
Intel VT-x : Compatible con T5500 (L2), T5600 y todos los T7xxx.
Conmutación dinámica de frecuencia del bus frontal de Intel : compatible con las revisiones E1, G0, G2 y M0.
Los procesadores Socket P pueden regular la velocidad del bus frontal (FSB) entre 400 y 800 MT/s según sea necesario.
Tamaño de la matriz : 143 ^mm² ( Merom), 111 ^mm² ( Merom-2M)
Pasos : B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
Todos los modelos con motor stepping B2 se lanzaron en julio de 2006, y los modelos con motor stepping L2 se lanzaron en enero de 2007.

Véase también: Existen versiones del mismo núcleo Merom-2M con la mitad de la caché L2 desactivada, disponibles bajo la marca Pentium Dual-Core .

"Merom" (bajo voltaje, 65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT).
Conmutación dinámica de frecuencia del bus frontal de Intel : compatible con las revisiones E1, G0 y G2.
Tamaño de la matriz : ¹⁴³ mm²
Pasos : B2, E1, G0, G2

"Merom-2M" (ultrabajo voltaje, 65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x
Tamaño de la matriz : ¹¹¹ mm²
Pasos : L2, M0

"Merom XE" (65 nm)

Estos modelos cuentan con un multiplicador de reloj desbloqueado.

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
Los procesadores Merom XE admiten la limitación dinámica del bus frontal (Dynamic Front Side Bus Throttling) entre 400 y 800 MT/s.
Tamaño de la matriz : ¹⁴³ mm²
Pasos : E1, G0

"Penryn-L" (45 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Los procesadores Socket P pueden regular la velocidad del bus frontal (FSB) entre 400 y 800 MT/s según sea necesario.
^Tamañode la matriz : 82 mm²
228 millones de transistores
Tamaño del paquete: 22 mm × 22 mm
Pasos : M0, R0

"Penryn" (específico para Apple iMac, 45 nm)

Tamaño de la matriz : ¹⁰⁷ mm²
El iMac de 20 pulgadas de 2008 utilizaba los procesadores E8135 y E8335 a una frecuencia de reloj inferior a la especificada, lo que explica por qué el mismo modelo se utiliza a diferentes frecuencias. Esta lista muestra las frecuencias utilizadas por Apple.
Pasos : C0, E0

"Penryn", "Penryn-3M" (voltaje estándar, 45 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA) ^{[ 11 ]}
T6570, ^{[ 12 ]} T6670, todos los modelos T8xxx y T9xxx son compatibles con Intel VT-x
Todos los modelos T9xxx son compatibles con la tecnología de ejecución segura (TXT).
Los modelos T6xxx son procesadores Penryn-3M con 1 MB de caché L2 desactivada.

Cabe destacar que los modelos T8100, T8300, T9300 y T9500 son procesadores Penryn diseñados para plataformas Santa Rosa Refresh con un FSB máximo de 800 MT/s, mientras que el resto de los procesadores Penryn están diseñados para plataformas Montevina que pueden alcanzar un FSB máximo de 1066 MT/s.

Los procesadores Penryn admiten la limitación dinámica del bus frontal (Dynamic Front Side Bus Throttling) entre 400 y 800 MT/s.

Tamaño del troquel : 107 mm ² (Penryn), 82 mm ² (Penryn-3M)
Pasos : C0, E0 (Penryn) M0, R0 (Penryn-3M) ^{[ 11 ]}

"Penryn", "Penryn-3M" (media tensión, 45 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x (excepto los modelos P7350 y P7450 que no son para Mac), ^{[ 13 ]}^{[ 14 ]}^{[ 15 ]} Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Algunos subconjuntos de procesadores de la serie P7000 de Apple son compatibles con Intel VT-x. ^{[ 16 ]}
Los procesadores Penryn y Penryn-3M admiten la limitación dinámica del bus frontal (Dynamic Front Side Bus Throttling) en un rango de 533 a 1066 MT/s.
Tamaño del troquel : 107 mm ² (Penryn), 82 mm ² (Penryn-3M)
Tamaño del paquete: 35 mm × 35 mm
Transistores: 410 millones ^{[ 17 ]}
Pasos : ( Pasos de microarquitectura central de 45 nm )
- C0, E0 (Penryn)
- M0, R0 (Penryn-3M)
- La revisión C0/M0 solo se utiliza en la plataforma Intel Mobile 965 Express ( Santa Rosa refresh ).
- La revisión E0/R0 añade dos nuevas instrucciones (XSAVE/XRSTOR) y es compatible con la plataforma Intel Mobile 4 Express ( Montevina ) posterior.

"Penryn" (voltaje medio, 45 nm, factor de forma pequeño)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Tamaño de la matriz : ¹⁰⁷ mm²
Tamaño del paquete: 22 mm × 22 mm
Pasos : C0 , E0

"Penryn" (bajo voltaje, 45 nm, factor de forma pequeño)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Tamaño de la matriz : ¹⁰⁷ mm²
Tamaño del paquete: 22 mm × 22 mm
Pasos : C0 , E0

"Penryn-3M" (ultrabajo voltaje, 45 nm, factor de forma pequeño)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) (excepto SU7300), Intel Dynamic Acceleration (IDA)
Tamaño de la matriz : ¹⁰⁷ mm²
Tamaño del paquete: 22 mm × 22 mm
Pasos : M0 , R0

"Penryn XE" (45 nm)

Estos modelos cuentan con un multiplicador de reloj desbloqueado.
Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT)
Los procesadores Penryn XE admiten la limitación dinámica del bus frontal (Dynamic Front Side Bus Throttling) entre 400 y 800 MT/s y entre 533 y 1066 MT/s.
Tamaño de la matriz : ¹⁰⁷ mm²
Pasos : C0, E0

"Penryn QC" (45 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT)
Puede regular la velocidad del bus frontal (FSB) entre 533 y 1066 MT/s según sea necesario.
^Tamañodel troquel : 2 × 107 mm²
Pasos : E0

"Penryn QC XE" (45 nm)

Este modelo cuenta con un multiplicador de reloj desbloqueado que normalmente se manipula a través de la BIOS del sistema; sin embargo, algunos fabricantes (como HP ) no tienen esta función habilitada en sus portátiles que utilizan este procesador.
Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT)
Puede regular la velocidad del bus frontal (FSB) entre 533 y 1066 MT/s según sea necesario.
Tamaño del paquete: 35 mm × 35 mm
^Tamañodel troquel : 2 × 107 mm²
Pasos : E0

Core i (1.ª generación)

Clarksfield

Características comunes:

Zócalo: G1 .
Todas las CPU son compatibles con memoria RAM DDR3-1333 de doble canal .
Todos los modelos de CPU ofrecen 16 carriles PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 1.0 hacia el chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 45 nm .
Los procesadores con sufijo XM tienen el multiplicador desbloqueado y se pueden overclockear.

Arrandale

Características comunes:

Zócalo: Todos los modelos (excepto el i3-380M) están disponibles en BGA-1288; los modelos con sufijo M (excluyendo los sufijos UM y LM) también están disponibles como zócalo G1 .
Todas las CPU son compatibles con memoria RAM DDR3 de doble canal . Todos los modelos la admiten a velocidades de 800 MT/s, mientras que los modelos con sufijo M y LM admiten velocidades de hasta 1066 MT/s.
Todos los modelos de CPU ofrecen 16 carriles PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 1.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 32 nm .

Core i (2.ª generación)

Sandy Bridge-M

Características comunes:

Zócalo: G2 , BGA 1023 (modelos de doble núcleo), BGA 1224 (modelos de cuatro núcleos).
Todas las CPU admiten memoria RAM DDR3 de doble canal . Todos los modelos la admiten a velocidades de 1333 MT/s, mientras que los modelos i7-2720QM y superiores admiten velocidades de hasta 1600 MT/s.
Todos los modelos de CPU ofrecen 16 carriles PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 32 nm .
Los modelos con sufijo XM tienen el multiplicador desbloqueado y se pueden overclockear.

Core i (3.ª generación)

Puente de hiedra

Características comunes:

Zócalo: G2 , BGA 1023 (modelos de doble núcleo), BGA 1224 (modelos de cuatro núcleos).
Todas las CPU son compatibles con memoria RAM DDR3 o DDR3L de doble canal , con una velocidad de hasta 1600 MT/s.
Todos los modelos de CPU ofrecen 16 líneas PCIe, excepto los modelos con sufijo Y, que no son compatibles con PCIe. Los modelos i5 e i7 con sufijos M, QM y XM son compatibles con PCIe 3.0 , mientras que el resto de modelos lo son con PCIe 2.0.
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .
Los modelos con sufijo XM tienen el multiplicador desbloqueado y se pueden overclockear.

Core i (4.ª generación)

Haswell-MB

Características comunes:

Zócalo: G3 .
Todas las CPU son compatibles con memoria RAM DDR3L de doble canal , con una velocidad de hasta 1600 MT/s.
Todos los modelos de CPU ofrecen 16 líneas PCIe. Los modelos i5 e i7 lo admiten a velocidades PCIe 3.0 , mientras que los modelos i3 lo admiten a velocidades PCIe 2.0.
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .
Los modelos con sufijo MX tienen el multiplicador desbloqueado y se pueden overclockear.

Haswell-ULT

Características comunes:

Zócalo: BGA 1168.
Todas las CPU admiten memoria RAM DDR3L o LPDDR3 de doble canal , con una velocidad de hasta 1600 MT/s.
Todos los modelos de CPU ofrecen 12 líneas PCIe 2.0 , excepto los modelos i3-4xx5U, que ofrecen 10 líneas PCIe 2.0.
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .

Haswell-ULX

Características comunes:

Zócalo: BGA 1168.
Todas las CPU admiten memoria RAM DDR3L o LPDDR3 de doble canal , con una velocidad de hasta 1600 MT/s.
Todos los modelos de CPU ofrecen 12 carriles PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .

Haswell-H

Características comunes:

Zócalo: BGA 1364.
Todas las CPU son compatibles con memoria RAM DDR3L de doble canal , con una velocidad de hasta 1600 MT/s.
Todos los modelos de CPU ofrecen 16 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Los modelos con GPU integrada Iris Pro 5200 también incluyen 128 MB de eDRAM , que actúa como caché L4.
Proceso de fabricación: 22 nm .
El procesador i7-4950HQ viene con el multiplicador desbloqueado, lo que permite a los usuarios aumentar su velocidad de reloj más allá de la velocidad establecida de fábrica.

Core i (5ª generación)

Universidad Broadwell

Características comunes:

Zócalo: BGA 1168.
Todas las CPU admiten memoria RAM DDR3L o LPDDR3 de doble canal , con una velocidad de hasta 1600 MT/s. Los modelos i5-5350U o superiores, junto con todos los modelos ix-5xx7, admiten LPDDR3 con una velocidad de hasta 1866 MT/s.
Todos los modelos de CPU ofrecen 12 carriles PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .

Broadwell-H

Características comunes:

Zócalo: BGA 1364.
Todas las CPU admiten memoria RAM DDR3L o LPDDR3 de doble canal , con una velocidad de hasta 1866 MT/s.
Todos los modelos de CPU ofrecen 16 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Los modelos con GPU integrada Iris Pro 6200 también incluyen 128 MB de eDRAM , que actúa como caché L4.
Proceso de fabricación: 14 nm .

Núcleo M (5.ª generación)

Broadwell-Y

Características comunes:

Zócalo: BGA 1234.
Todas las CPU admiten memoria RAM DDR3L , DDR3L-RS o LPDDR3 de doble canal , con una velocidad de hasta 1600 MT/s.
Todos los modelos de CPU ofrecen 12 carriles PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 2.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .

Core i (6.ª generación)

Universidad Skylake

Características comunes:

Zócalo: BGA 1356.
Todas las CPU admiten memoria RAM DDR4 de doble canal a 2133 MHz, DDR3L a 1600 MHz o LPDDR3 a 1866 MHz.
Todos los modelos de CPU ofrecen 12 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .

Skylake-H

Características comunes:

Zócalo: BGA 1440.
Todas las CPU admiten memoria RAM DDR4 de doble canal a 2133 MHz, DDR3L a 1600 MHz o LPDDR3 a 1866 MHz.
Todos los modelos de CPU ofrecen 16 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Los modelos con GPU integrada Iris Pro 580 también incluyen 128 MB de eDRAM , que actúa como caché L4.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen el multiplicador desbloqueado, lo que permite aumentar su frecuencia de reloj.

Núcleo M (6.ª generación)

Skylake-Y

Características comunes:

Zócalo: BGA 1515.
Todas las CPU admiten memoria RAM DDR3L de doble canal a 1600 MHz o LPDDR3 a 1866 MHz.
Todos los modelos de CPU ofrecen 10 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .

Core i (7.ª generación)

Universidad del Lago Kaby

Características comunes:

Zócalo: BGA 1356.
Todas las CPU admiten memoria RAM DDR4 de doble canal a 2133 MHz, DDR3L a 1600 MHz o LPDDR3 a 1866 MHz.
Todos los modelos de CPU ofrecen 12 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .

Lago Kaby-H

Características comunes:

Zócalo: BGA 1440.
Todas las CPU admiten memoria RAM DDR4 de doble canal a 2400 MHz, DDR3L a 1600 MHz o LPDDR3 a 2133 MHz.
Todos los modelos de CPU ofrecen 16 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen el multiplicador desbloqueado, lo que permite aumentar su frecuencia de reloj.

Lago Kaby-Y

Características comunes:

Zócalo: BGA 1515.
Todas las CPU admiten memoria RAM LPDDR3 de doble canal a 1866 MHz o DDR3L a 1600 MHz.
Todos los modelos de CPU ofrecen 10 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .

Núcleo M (7.ª generación)

Lago Kaby-Y

Los modelos Core m5 y Core m7 fueron renombrados como Core i5 y Core i7 .

Características comunes:

Zócalo: BGA 1515.
Todas las CPU admiten memoria RAM DDR3L de doble canal a 1600 MHz o LPDDR3 a 1866 MHz.
Todos los modelos de CPU ofrecen 10 carriles PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .

Core i (8.ª generación)

Universidad del Lago del Café

Características comunes:

Zócalo: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Coffee Lake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Coffee Lake-B

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Kaby Lake Refresh

Common features:

Socket: BGA 1356.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 12 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Kaby Lake-G

Common features:

Socket: BGA 2270.
All the CPUs support dual-channel DDR4-2400 RAM.
All CPU models provide 8 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Amber Lake-Y

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Whiskey Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Cannon Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 10 nm.

Core M (8th gen)

Amber Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (9th gen)

Coffee Lake-H (refresh)

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Core i (10th gen)

Comet Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Comet Lake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Ice Lake-U

Common features:

Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
PCIe 3.0 support.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 10 nm.

Ice Lake-Y

Common features:

Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
PCIe 3.0 support.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 10 nm.

Amber Lake-Y (10xxx)

Common features:

Socket: BGA 1377, except for i3-10100Y which uses BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (11th gen)

Tiger Lake-UP3

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Tiger Lake-UP4

Common features:

Socket: BGA 1598.
All the CPUs support dual-channel LPDDR4X-4266 RAM.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Tiger Lake-H

Common features:

Socket: BGA 1787.
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Tiger Lake-H35

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Core i (12th gen)

Alder Lake-U

Common features:

Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.^[24]

Alder Lake-P

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The following models are available with IPU (image processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Alder Lake-H

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Alder Lake-HX

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The i9 models have unlocked multipliers, allowing them to be overclocked.

Alder Lake-N

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

Socket: BGA 1264.
All the CPUs support single-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
All CPU models provide 9 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache: 2 MB per cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Core i (13th gen)

Raptor Lake-U

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The i3-1315U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Raptor Lake-P

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (32 KB data + 64 KB instructions) per core.
L2 cache:
- P-cores: (up to) 2 MB per core.
- E-cores: (up to) 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Raptor Lake-H

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
The i5-13500H is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Raptor Lake-PX

Common features:

Socket: BGA 1792.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Raptor Lake-HX

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13645HX, i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
All models support CPU, iGPU, and memory overclocking.^[25]
i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Core i (14th gen)

Raptor Lake-HX Refresh

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
All models support CPU, iGPU, and memory overclocking.
i7-14650HX, i7-14700HX, and i9-14900HX feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
i7-14700HX, and i9-14900HX feature Intel Application Optimization.

Core / Core Ultra 3/5/7/9 (Series 1)

Raptor Lake-U Refresh

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Xe-LP architecture.
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The Core 3 100U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Meteor Lake-U

Common features:

Socket: BGA 2049.
All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.

Meteor Lake-H

Common features:

Socket: BGA 2049.
All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.

Core / Core Ultra 5/7/9 (Series 2)

Raptor Lake-U Refresh

Common features:

Socket: BGA 1744.
All CPUs support dual-channel DDR4-3200, LPDDR4X-4266, DDR5-5200, and LPDDR5(X)-6400 RAM.

Arrow Lake-U

Common features:

Socket: BGA 2049.
All CPUs support DDR5-6400 and LPDDR5X-8400 RAM.

Lunar Lake

Common features:

Socket: BGA 2833.
All the CPUs support dual-channel LPDDR5X-8533 RAM (on package).
All CPU models provide 4 lanes of PCIe 5.0.
L1 cache:
- P-cores: 112 KB (48 KB (12-Way) data + 64 KB (16-Way) instructions) per core.
- E-cores: 96 KB (32 KB (8-Way) data + 64 KB (16-Way) instructions) per core.
L2 cache:
- P-cores: 2.5 MB (10-Way) per core.
- E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.

Raptor Lake-H Refresh

Common features:

Socket: BGA 1744.
All CPUs support DDR4-3200, LPDDR4X-4266, DDR5-5200, or LPDDR5(X)-5200 RAM.

Arrow Lake-H

Common features:

Socket: BGA 2049.
All CPUs support dual-channel DDR5-6400 and LPDDR5(X)-8400 RAM.

Arrow Lake-HX

Common features:

Socket: BGA 2114.
All CPUs support dual-channel DDR5-6400 RAM and Core Ultra 290HX Plus, 270HX Plus also support DDR5-7200 RAM.
- Core Ultra 245HX, 265HX, and 285HX support ECC memory.
Core Ultra 9 285HX supports Intel vPro and related technologies.

Twin Lake-N

Common features:

Socket: BGA 1264.
All CPUs support dual-channel DDR4-3200 or single-channel DDR5 or LPDDR5-4800 RAM.

Core / Core Ultra 5/7/9 (Series 3)

Panther Lake

Common features:

Socket: BGA 2540.
All CPUs support dual-channel memory.
Fabrication process:
- 8 Core + 4 Xe GPU: Compute Tile (Contains the CPU cores) Intel's 18A process node, GPU tile "Intel 3" process node.
- 16 Core + 4 Xe GPU: Compute Tile (Contains the CPU cores) Intel's 18A process node, GPU tile "Intel 3" process node.
- 16 Core + 12 Xe GPU: Compute Tile (Contains the CPU cores) Intel's 18A process node, GPU tile TSMC's N3E process node.

Wildcat Lake

Common features:

All CPUs support single-channel DDR5-6400(max. 64 GB) and LPDDR5(X)-7467(max. 48 GB) RAM.
Fabrication process: Intel's 18A process node.

References

"SLA4C (Intel Core 2 Duo T5850)". CPU-World. Archived from the original on May 3, 2023. Retrieved October 27, 2018.
↑"SLA4C (Intel Core 2 Duo T5850)". CPU-World. Archived from the original on May 3, 2023. Retrieved October 27, 2018.
"SLB6D (Intel Core 2 Duo T5900)". CPU-World. Archived from the original on May 5, 2023. Retrieved October 27, 2018.
↑"SLB6D (Intel Core 2 Duo T5900)". CPU-World. Archived from the original on May 5, 2023. Retrieved October 27, 2018.
"SL9U5 (Intel Core 2 Duo T7600G)". CPU-World. Archived from the original on May 6, 2023. Retrieved October 27, 2018.
↑"SL9U5 (Intel Core 2 Duo T7600G)". CPU-World. Archived from the original on May 6, 2023. Retrieved October 27, 2018.
Shah, Agam (February 11, 2008). "Intel develops processor similar to MacBook Air chip". InfoWorld. Archived from the original on October 28, 2018. Retrieved October 27, 2018.
↑Shah, Agam (February 11, 2008). "Intel develops processor similar to MacBook Air chip". InfoWorld. Archived from the original on October 28, 2018. Retrieved October 27, 2018.
1 2"Support for Intel Processors". Intel. Archived from the original on June 23, 2019. Retrieved June 26, 2019.
↑Shimpi, Anand Lai (January 17, 2008). "The MacBook Air CPU Mystery: More Details Revealed". AnandTech. Archived from the original on January 5, 2010. Retrieved October 27, 2018.
1 2"Intel Core2 Duo Processor T6400 (2M Cache, 2.00 GHz, 800 MHz FSB)". Intel Corporation. Archived from the original on February 12, 2009. Retrieved February 6, 2009.
↑"Intel Core2 Duo Processor T6570 (2M Cache, 2.10 GHz, 800 MHz FSB)". Intel Corporation. Archived from the original on July 4, 2011. Retrieved March 20, 2010.
↑"Intel® Core™2 Duo Mobile Processor P7350 – SLB53". Intel. Archived from the original on February 5, 2009. Retrieved February 9, 2009.
↑"Intel® Core™2 Duo Mobile Processor P7450 – SLB54". Intel. Archived from the original on May 16, 2009. Retrieved May 2, 2009.
↑"Intel product specifications". ark.intel.com. Archived from the original on July 4, 2011. Retrieved June 26, 2019.
↑Eric Tung (March 13, 2009). "Re: Does VMware Fusion require a CPU supporting Intel VT-x?". Archived from the original on July 19, 2009. Retrieved April 18, 2009.
↑Wong, Dr. Adrian (August 14, 2019). "Tech ARP – Mobile CPU Comparison Guide Rev. 12.3". Techarp.com. Archived from the original on September 10, 2015. Retrieved December 18, 2015.
↑"[ Hardware.Info ] – Intel Core 2 Duo P8400 [BX80577P8400]". September 2, 2008. Archived from the original on September 2, 2008. Retrieved June 26, 2019.
↑"[ Hardware.Info ] – Intel Core 2 Duo P8600 [BX80577P8600]". February 8, 2009. Archived from the original on February 8, 2009. Retrieved June 26, 2019.
↑"CPU-Upgrade: Intel Core i3-2332M CPU". cpu-upgrade.com. Archived from the original on September 18, 2017. Retrieved May 26, 2026.
↑"CPU-Upgrade: Intel Core i3-2308M CPU". cpu-upgrade.com. Archived from the original on June 28, 2016. Retrieved May 26, 2026.
↑"CPU-Upgrade: Intel Core i3-4010M CPU". cpu-upgrade.com. Retrieved May 26, 2026.
↑Pirzada, Usman (August 1, 2019). "Intel Launches 10th Generation 10nm 'Ice Lake' Mobility Processors - Led By Core i7 1068G7 Flagship With 3.6 GHZ All Core Boost". Wccftech. Archived from the original on May 1, 2023. Retrieved May 25, 2026.
↑Ali, Yusuf (October 19, 2024). "i7-1365u vs i7-1260u Gaming: Performance Showdown". TechUp Daily. Retrieved October 23, 2024.{{cite web}}: CS1 maint: url-status (link)
↑Intel Corporation. "13th Gen Intel Core Mobile Processor Product Brief". Intel. Archived from the original on May 11, 2023. Retrieved May 26, 2026.

ATI provides pointer to Intel's 'Allendale', May 23, 2006
Rumoured prices and specifications for Intel Core 2, May 30, 2006
TGDaily indicates leaked release dates, July 24, 2006
Intel to unveil five Merom CPUs in July, paper says(subscription required) as re-reported by DigiTimes, July 17, 2006
Intel Unveils World's Best Processor, July 27, 2006
Intel Takes Popular Laptops to 'Extreme' with First-Ever Extreme Edition Mobile Processor; Adds New Desktop Chip, July 16, 2007
CORE 2 DUO 1333 MHZ STEPPINGArchived May 20, 2022, at the Wayback Machine, July 18, 2007

External links

Search MDDS Database
Intel ARK Database
SSPEC/QDF Reference (Intel)
Intel® Processor Names, Numbers and Generation List
Intel CPU Transition Roadmap 2008–2013
Intel Desktop CPU Roadmap 2004–2011
Intel Core Solo mobile processor product order code table
Intel Core Duo mobile processor product order code table
Intel Core Duo Processor and Core Solo Processor on 65 nm Process Datasheet
Intel Core Duo Processor and Core Solo Processor on 65 nm Process Specification Update
Intel Core 2 Duo Processors Technical Documents
Intel Core i3 desktop processor product order code table
Intel Core i3 mobile processor product order code table
Intel Core i5 desktop processor product order code table
Intel Core i5 mobile processor product order code table
Intel Core i7 desktop processor product order code table
Intel Core i7 mobile processor product order code table
Intel Core i7 desktop processor Extreme Edition product order code table
Intel Core i7 mobile processor Extreme Edition product order code table
Intel's Core i7 web page
Intel's Core i7 Extreme Edition web page
Intel's Core i7 Processor Numbers
Intel's Core i7 Extreme Edition Processor Numbers
Lista de precios de procesadores de Intel Corporation
Lista de precios de procesadores de Intel Corporation
Procesadores Intel Core serie X

[1] "SLA4C (Intel Core 2 Duo T5850)". CPU-World. Archived from the original on May 3, 2023. Retrieved October 27, 2018.

[2] "SLA4C (Intel Core 2 Duo T5850)". CPU-World. Archived from the original on May 3, 2023. Retrieved October 27, 2018.

[3] "SLB6D (Intel Core 2 Duo T5900)". CPU-World. Archived from the original on May 5, 2023. Retrieved October 27, 2018.

[4] "SLB6D (Intel Core 2 Duo T5900)". CPU-World. Archived from the original on May 5, 2023. Retrieved October 27, 2018.

[5] "SL9U5 (Intel Core 2 Duo T7600G)". CPU-World. Archived from the original on May 6, 2023. Retrieved October 27, 2018.

[6] "SL9U5 (Intel Core 2 Duo T7600G)". CPU-World. Archived from the original on May 6, 2023. Retrieved October 27, 2018.

[7] Shah, Agam (February 11, 2008). "Intel develops processor similar to MacBook Air chip". InfoWorld. Archived from the original on October 28, 2018. Retrieved October 27, 2018.

[8] Shah, Agam (February 11, 2008). "Intel develops processor similar to MacBook Air chip". InfoWorld. Archived from the original on October 28, 2018. Retrieved October 27, 2018.

[intel.com-9] 1 2"Support for Intel Processors". Intel. Archived from the original on June 23, 2019. Retrieved June 26, 2019.

[10] Shimpi, Anand Lai (January 17, 2008). "The MacBook Air CPU Mystery: More Details Revealed". AnandTech. Archived from the original on January 5, 2010. Retrieved October 27, 2018.

[T6xxx-11] 1 2"Intel Core2 Duo Processor T6400 (2M Cache, 2.00 GHz, 800 MHz FSB)". Intel Corporation. Archived from the original on February 12, 2009. Retrieved February 6, 2009.

[T6570-12] "Intel Core2 Duo Processor T6570 (2M Cache, 2.10 GHz, 800 MHz FSB)". Intel Corporation. Archived from the original on July 4, 2011. Retrieved March 20, 2010.

[P7350-13] "Intel® Core™2 Duo Mobile Processor P7350 – SLB53". Intel. Archived from the original on February 5, 2009. Retrieved February 9, 2009.

[P7450-14] "Intel® Core™2 Duo Mobile Processor P7450 – SLB54". Intel. Archived from the original on May 16, 2009. Retrieved May 2, 2009.

[P7550-15] "Intel product specifications". ark.intel.com. Archived from the original on July 4, 2011. Retrieved June 26, 2019.

[16] Eric Tung (March 13, 2009). "Re: Does VMware Fusion require a CPU supporting Intel VT-x?". Archived from the original on July 19, 2009. Retrieved April 18, 2009.

[Techarp20151218-17] Wong, Dr. Adrian (August 14, 2019). "Tech ARP – Mobile CPU Comparison Guide Rev. 12.3". Techarp.com. Archived from the original on September 10, 2015. Retrieved December 18, 2015.

[18] "[ Hardware.Info ] – Intel Core 2 Duo P8400 [BX80577P8400]". September 2, 2008. Archived from the original on September 2, 2008. Retrieved June 26, 2019.

[19] "[ Hardware.Info ] – Intel Core 2 Duo P8600 [BX80577P8600]". February 8, 2009. Archived from the original on February 8, 2009. Retrieved June 26, 2019.

[20] "CPU-Upgrade: Intel Core i3-2332M CPU". cpu-upgrade.com. Archived from the original on September 18, 2017. Retrieved May 26, 2026.

[21] "CPU-Upgrade: Intel Core i3-2308M CPU". cpu-upgrade.com. Archived from the original on June 28, 2016. Retrieved May 26, 2026.

[22] "CPU-Upgrade: Intel Core i3-4010M CPU". cpu-upgrade.com. Retrieved May 26, 2026.

[23] Pirzada, Usman (August 1, 2019). "Intel Launches 10th Generation 10nm 'Ice Lake' Mobility Processors - Led By Core i7 1068G7 Flagship With 3.6 GHZ All Core Boost". Wccftech. Archived from the original on May 1, 2023. Retrieved May 25, 2026.

[24] Ali, Yusuf (October 19, 2024). "i7-1365u vs i7-1260u Gaming: Performance Showdown". TechUp Daily. Retrieved October 23, 2024.{{cite web}}: CS1 maint: url-status (link)

[25] Intel Corporation. "13th Gen Intel Core Mobile Processor Product Brief". Intel. Archived from the original on May 11, 2023. Retrieved May 26, 2026.

[ 11 ]

[ 12 ]

[ 13 ]

[ 14 ]

[ 15 ]

[ 16 ]

[ 17 ]

[24]

[25]